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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Temperature Tape High Frequency PCB Wireless Rogers 4003 PCB With Bluetooth Moudle

Shenzhen Xinchenger Electronic Co.,Ltd

High Temperature Tape High Frequency PCB Wireless Rogers 4003 PCB With Bluetooth Moudle

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Rogers

Layer : 2

Color : /

Min line space : 4mil

Min line width : 4mil

Copper thickness : 1OZ

Board size : 58*159mm

Panel : 1

Surface : Immersion Gold

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High Temperature Tape High Frequency PCB Wireless Rogers 4003 PCB With Bluetooth Moudle

Specification:

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

Layer: 2 Layer
Material: PTFE
Board Thickness: 1.6mm
Surface Treatment: Immersion Gold
Solder Mask: Green
Size:58*159mm
Copper Thickness: 1.0oZ
Min. Line Spacing: 0.25mm
Min Trace Space: 0.25mm

Detailed Terms for Pcb Assembly

We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Rogers PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing.

1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
4. ROHS compliant and lead-free process.
5. In-circuit, functional tests& burn-in tests, full system test
6. High output to guarantee prompt delivery.

We have experience in manufacturing PCB from single layer till 18layers, Nowdays, more and more high fluquency boards are demanded, we have a special department for those field PCBs.

And we have some professional engineers for taking care of those PCBs too. We can provide much lower price than the marcket because of large material ordered by one time. Welcome you join to us.

XCE have the ability of manufacturing many types of specail board. The products are including Rogers, and Teflon Board.

Standard dimension: 490 X 490mm 600 X 500mm (optional dimension for discussion)
Standard thickness: 1.0, 1.5, 2.0, 3.0 mm(optional dimension for discussion)
Copper foil thickness: 35um, 70um, 105um, 140um, 210um
Heat conduction and insulating layer thickness: 60um

Specification:

Brand: XCE
Model: XCEH
Board size: 58*159MM
Cu thickness: 35UM
Material: Rogers
Min line space&width: 5Mil


Advantage
High Temperature Tape PCB Board Wireless Rogers 4003 PCB With Bluetooth Moudle
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

Parameter:

PRODUCT’S DETAILS
Raw Material Rogers
Layer Count 2-Layer
Board Thickness 1.6mm
Copper Thickness 35UM
Surface Finish Immerison Silver
Solder Mask /
Silkscreen /
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 60*159mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

We can offer production with high quality and competitive:

Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L_18L, HDI 20-28 , HDI
Material FR4
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , Rogers3003+FR4
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
1-2L Lead-time 3-7 days 1-2 days
4- 8L Lead-time 7-10 days 2-7 days
10-18L Lead-time 10-15 days 4-9 days
20-28L Lead-time 15-20 days
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

Parameter

XCE PCB technical specifications
Material Rogers
Layer No. 2
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin,

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating


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